The 18 layers blind hole board produced by Uniwell Circuits adopts high-performance materials such as RO4350B+RO4450F, supports multi-stage blind hole structures (such as L1-13, L14-18, etc.), and the minimum inner space can reach 0.15mm. It is suitable for scenarios with strict requirements for wiring density and signal integrity, such as high-frequency and high-speed communication, high-end industrial control, and automotive electronics.
This type of board belongs to the extended application of high-density interconnect () technology. Uniwell Circuits has the ability to develop and mass produce HDI rigid and flexible boards from first to third order. Over the years, it has successfully developed samples of third-order HDI rigid and flexible boards, and its technological accumulation can support the stable manufacturing of complex multi-layer blind hole structures.
Number of floors: 18
Material combination: FR408HR, RO4350B+RO4450F and other high-frequency and high-speed materials.
Blind hole design: supports blind holes in multiple areas (such as L1-13, L14-18).
Inner space: minimum 0.15mm, meeting high-density wiring requirements.
Surface treatment: Optional processes such as immersion silver and immersion gold can be used to improve welding reliability.
This type of high-level blind hole board is commonly used in high-end electronic devices such as 5G base stations, server backboards, and intelligent driving domain controllers, with extremely high requirements for thermal management, signal integrity, and structural strength.
high-frequency,HD